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Chip Bonding Tools

Chip Bonding Tools

SPT covers a wide range of Chip Bonding Tools, from the time the silicon chip is picked up from the wafer, and placed on the substrate or lead frame up to the period where the actual bonding process takes place. This is where the chips are electrically connected to the outside world using gold, aluminium or copper wire. Our wide ranges of Chip Bonding Tools include:

精细陶瓷解决方案

精细陶瓷解决方案

专为公差为微米等级的小型复杂及精密组件提供精细陶瓷解决方案 材料 包括氧化铝,氧化锆,氧化锆增韧氧化铝及多晶红宝石。SPT 具备在陶瓷或金属陶瓷材料上做微孔的专业工艺,我们每时每刻随处准备为你服务。
产品:
 

Fine Machining Parts

Fine Machining Parts

SPT’s long years of experience in manufacturing watch jewels has led us to produces customized high precision, wear-resistant parts made of steel and carbides like:

  • Cold Forming Tools
  • Cutting Blades
  • Nozzles
  • Wire Guides
  • Ultra precision High Speed Milling and Wire EDM with CAD/CAM processing

News

7th - 9th May 2019
 
Exhibition Centre
Nuremberg Messezentrum
90471 Nuremberg
Germany
Visit us at
Hall 4A Booth 146


7th - 9th May 2019
 
  Messe, Stuttgart
Germany
Visit us at
Hall 9, Booth B38

 
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