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Bonding Capillaries

 
SPT offers a wide range of bonding capillaries with designs and features optimized for your bonding needs. From standard bonding packages, such as SOIC, TSOP up to complex bonding applications for low-k, stacked die, multi-tier, Cu wire, ultra fine-pitch bonding and many more. SPT capillaries support your widest array of bonding applications and challenges.
CR - The Leading Choice For Copper Wire Bonding

CR - The Leading Choice For Copper Wire Bonding

  • Enhanced coupling between wire and capillary tip surface
  • Excellent long term bonding stability
  • Increased durability - higher mechanical resistance
AG Alloy Wire Bonding Capillary

AG Alloy Wire Bonding Capillary

Applications:

 
 
 
  • DRAM
  • IC
  • LED
AZR Long Life Material for Cu Wire Bonding

AZR Long Life Material for Cu Wire Bonding

Extended Capillary Touchdowns  
Improved MTBA
No Change In Bonding Parameters
Consistent Bond Quality

QFN Package Copper & Gold Wire Bonding Capillary

QFN Package Copper & Gold Wire Bonding Capillary

  • Solutions For QFN Package Copper & Gold Wire
Copper Wire Bonding Capillary

Copper Wire Bonding Capillary

  • Fine & Large Wire                                          
3X Longer Tool Life

3X Longer Tool Life

  • SPT 'Infinity' capillary material extends the tool life up to 3X its original tool life
Capillary Material

Capillary Material

Small Precision Tools wire bonding capillaries are formed out of an ultra-pure 99.99% Al2O3 fine grade ceramic powder......
Bonding Capillary Catalog

Bonding Capillary Catalog

Get other Catalogs and Publications from our Chip Bonding Tools


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News

7th - 9th May 2019
 
Exhibition Centre
Nuremberg Messezentrum
90471 Nuremberg
Germany
Visit us at
Hall 4A Booth 146


7th - 9th May 2019
 
  Messe, Stuttgart
Germany
Visit us at
Hall 9, Booth B38

 
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