SPT covers a wide range of Chip Bonding Tools, from the time the silicon chip is picked up from the wafer, and placed on the substrate or lead frame up to the period where the actual bonding process takes place. This is where the chips are electrically connected to the outside world using gold, aluminium or copper wire. Our wide ranges of Chip Bonding Tools include:
Ceramic injection moulding (CIM) of small complex & precise components in micron tolerances. Materials include Alumina, Zirconia, Zirconia-toughened Alumina and polycrystalline Ruby. SPT has micro-hole expertise with materials such as ceramics and cermets. Its around-the-clock advanced processing capabilities are available worldwide.
SPT’s long years of experience in manufacturing watch jewels has led us to produces customized high precision, wear-resistant parts made of steel and carbides like: