Total Bonding Solutions


Empowered by Advanced Test Services

In today’s electronics manufacturing environment, reduced product development cycle time and improved product quality are critical factors for company’s success. As the industry leader, SPT Roth Group has committed to R&D investment with its aim to maintain constant progress in its technological competence.

Our material research and process development laboratories in Switzerland and Singapore with dedicated technical staff are equipped to aid each customer with industries’ most comprehensive test equipment in the field of semiconductor wire bonding process and many other applications.

Our material research group has embarked on the critical role for advanced material development in the area of ceramic, metals and alloys characterization and mechanical property optimization in terms of processability, dimensional stability and enhanced material properties.

Our process development laboratory is centered on the conceptualization and validation of bonding tool design with the latest bonding and analytical equipment. The availability of these resources and our novel approach to bonding tool design also allow us to work with engineers not only on routine analyses but on their most challenging applications as well.

Our involvement with leading universities, research group and partnership with most OEMs have further elevated our technological capability to conceptualize new designs and provide total solution.

Our goal is to provide value-added customer services through technical synergy that will lead to a mutually profitable long-term partnership.


18th to 21st June 2019
Palexpo Geneva
Visit us at
Booth K89 

 10th to 11th July 2019

The International Centre
Telford, UK
Booth 1416

 9th - 11th July 2019

San Fransisco, USA 
Moscone Center
North Hall
Booth #6263

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