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Ultra Precision Solutions for Future Technology

 

Chip Bonding Tools

Fine Ceramic & Machining Parts

Bonding Capillaries
Bonding Capillaries for standard and ultra-fine pitch thermosonic gold or copper wire bonding.

Fine Ceramics Solutions
Fine Ceramic Parts - Producted with Cermic Injection Molding (CIM) TechnologySPT is specialized in developing and manufacturing custom ultra precise ceramic parts with Ceramic Injection Molding (CIM)  technology. See our
Application Examples

Die Bonding Tools
Die Bonding & Dispensing Tools for any die pick and place application.
Fine Machining Parts
Cold Forming Tools, Cutting Blades, Nozzles and Wire Guides made of steel and carbides.
High Speed Milling and Electro-Discharge Machining
 Flip Chip Handling Tools
Flip Chip Handling Tools used for Die and Bump Side pick and place application.
High Tech Materials
R&D of new High Tech Materials for Ceramic Injection Molding (CIM)
Bonding Wedges
Chip Bonding Wedges for Ultrasonic Bonding applicationsWedge Bonding Tools for ultrasonic aluminium or gold wire wedge bonding.
Technology
Ultra precision High Speed Milling and Wire EDM with CAD/CAM processing.
Single Point-TAB Bonding Tools
Single Point TAB Bonding Tools
Single Point-TAB Bonding Tools for Disk Drive Application.
Service & Support
SPT is committed to quality and customer care. We offer a wide range of proactive support and services such as consulting, design, analysis, training seminars and benchmarking partnerships. Read more...

News

 14th - 16th March 2018

Shanghai New International
Expo Centre
Shanghai, China
Hall N3, Booth 3733
 


10th - 13th April

Visit us at Ceramitec 2018
Hall B6, Booth 534
Messe München
Germany
 


 17th - 19th April 2018

Messe, Stuttgart
Germany
Visit us at
Hall H9, Booth 9A39


 8th - 10th May 2018

MITEC, Level 1
Kuala Lumpur, Malaysia
Hall 2&3, Booth 301

 
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