Semiconductor Tools - High Performance Ceramics HPC

SPT stands for the highest Precision and Quality in the Areas:

Bonding Tools for the Semiconductor Industry
High Performance Ceramics (HPC) for customized Micro-Precision Parts manufactured using the CIM process (Ceramic Injection Molding)
Customized High-Precision Parts in Carbide and Steel

We drive for total Customer Satisfaction. We achieve this through three factors:

Advanced technologies
Highest product quality and accuracy tools
Tailored to our customer’s designs

Learn more about SPT here

We strive on continuous quality improvements.
We achieve this through a committed management and highly-motivated employees.

Semiconductor Tools

We offer a wide range of semiconductor bonding tools, from die attach to wire bonding. These include die attach & vacuum pick up tools, flip chip and semiconductor wire bonding capillaries & wedges. We are your "One Stop Solution Partner".

Ceramics Applications

We are specialized in the development and manufacturing of customized high-precision ceramic parts using the Ceramic Injection Molding (CIM) process.

Mechanical Precision Parts

Building on many years of experience, SPT has pursued a logical course of development: From ruby to steel, from the production of jewel bearings, to the manufacturing of high-precision, wear-resistant components made of steel and carbide metals.

Semiconductor Tools - High Performance Ceramics HPC

SPT stands for the highest Precision and Quality in the Areas:

We strive on continuous quality improvements. We achieve this through a committed management and highly-motivated employees.

Semiconductor Tools

Ceramics Applications

Mechanical Precision Parts

Semiconductor Tools Fine Ceramics Precision Mechanics

We strive on continuous quality improvements.
We achieve this through a committed management and highly-motivated employees.

Semiconductor Tools

Fine Ceramics

Precision Mechanics